Research Article
Formation of Fine Line Circuits on Ferrite Substrate by Laser Direct Structuring Technology
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1 Department of Chemical and Materials Engineering, National Ilan University, Yilan County 260, Taiwan* Corresponding Author
Applied Functional Materials, 3(4), December 2023, 9-15, https://doi.org/10.35745/afm2023v03.04.0002
Published: 28 November 2023
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ABSTRACT
The technology of laser direct structuring (LDS) on ferrite substrates was evaluated for the fabrication of fine-line circuits. The LDS technology involves laser activation followed by electroless copper plating. A sieving pattern was scanned by the near IR laser on the ferrite substrates, and electroless copper plating was carried out. The results showed that the LDS technology applied to Ni-Zn-Cu-ferrite films. Appropriate laser activation conditions were chosen to engrave a contrast pattern on ferrite sheet samples. A chosen condition was used to fabricate a line width evaluation pattern, and the results indicated that the feasible fine width could be as fine as 50 μm.
CITATION (APA)
Tsai, H.-B., Lai, S.-Y., Pham, Q.-T., & Wu, H.-T. (2023). Formation of Fine Line Circuits on Ferrite Substrate by Laser Direct Structuring Technology. Applied Functional Materials, 3(4), 9-15. https://doi.org/10.35745/afm2023v03.04.0002
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